HBM4

Korean chipmakers Samsung in talks to supply customized HBM4 to Nvidia, Broadcom, Google

Samsung Electronics Co., the world’s leading memory chipmaker, is in talks to supply customized sixth-generation high-bandwidth memory, or HBM...

Korean chipmakers Samsung to expand in robotics, medtech; eyes sizeable M&As

Samsung Electronics Co. will accelerate its push into robotics, medical technology and next-generation semiconductor markets to secure new growth dr...

Korean chipmakers SK Hynix ships world’s first 12-layer HBM4 samples early

South Korean memory chip giant SK Hynix Inc. has begun delivering samples of the world’s most advanced, next-generation high bandwidth memory ...

Korean chipmakers SK Hynix to produce HBM4 on 3 nm foundry process in 2025

SK Hynix Inc. will adopt the 3-nanometer process, the most advanced foundry technology available, to produce customized HBM4 chips in the second hal...

Korean chipmakers Tesla asks Samsung, SK Hynix to supply HBM4 chip samples

Samsung Electronics Co. and SK Hynix Inc. are said to each be developing a sixth-generation high-bandwidth memory (HBM4) chip prototype for Tesla In...

Korean chipmakers Nvidia asks SK Hynix to bring forward HBM4 supply by 6 months

Nvidia Corp.’s Chief Executive Jensen Huang has asked SK Group Chairman Chey Tae-won to supply 12-layer HBM4 chips, the most advanced AI chips...

Korean chipmakers Samsung Electronics, TSMC tie up for HBM4 AI chip development

TAIPEI – South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, is partnering with its foundry rival Taiwan ...

Korean chipmakers Samsung to mass-produce HBM4 on 4 nm foundry process

Samsung Electronics Co., the world’s top memory chipmaker, plans to use its cutting-edge 4-nanometer (nm) foundry process for the mass product...

Korean chipmakers HBM chip war intensifies as SK Hynix hunts for Samsung talent

South Korean chipmaker SK Hynix Inc., just like its global peers, has largely designed and produced semiconductors in-house, including high-bandwidt...

Korean chipmakers Samsung to launch 3D HBM chip packaging service in 2024

SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a te...

Korean chipmakers Samsung showcases HBM3E DRAM, automotive chips

SILICON VALLEY -- Samsung Electronics Co. on Friday showcased a number of new-concept, next-generation DRAM chips, including the industry’s mo...

Korean chipmakers Samsung Elec to launch HBM4 in 2025 to win war in AI sector

Samsung Electronics Co., the world’s top memory chipmaker, aims to introduce sixth-generation top-performance High Bandwidth Memory4 (HBM4) DR...